KNOWN EXPLOITED VULNERABILITY
CISA KEV 处置信息
已确认在野利用
- 加入 KEV
- 2024/10/08
- 整改期限
- 2024/10/29已逾期 721 天
- CISA 厂商
- Qualcomm
- CISA 产品
- Multiple Chipsets
要求采取的措施
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
CISA 说明
https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/dsp-kernel/-/commit/0e27b6c7d2bd8d0453e4465ac2ca49a8f8c440e2 ; https://nvd.nist.gov/vuln/detail/CVE-2024-43047
漏洞描述
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.
影响产品
暂无结构化产品信息。
修复建议
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.