CISA KEV 处置信息
- 加入 KEV
- 2023/12/05
- 整改期限
- 2023/12/26已逾期 1029 天
- CISA 厂商
- Qualcomm
- CISA 产品
- Multiple Chipsets
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063
漏洞描述
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
影响产品
暂无结构化产品信息。
修复建议
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.